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netRAPID Chip Carrier | Design Guide

Figure 7: Footprint NRP 52

3.2.2 Thermal behavior and thermal pad

NRP 10 devices have a power consumption of 1 - 1.2 W and NRP 52 devices of 1.8 W, which

generates heat. The generated heat must be dissipated to prevent overheating of the chip. While

there is a hard limit for the chip’s junction temperature at 125 °C above, which malfunction and

permanent damage may occur, it is always desired to keep the junction temperature as low as

possible, as a semiconductor’s statistical life time generally decreases with rising temperature.

Make sure that the case temperature of the netX is always below 100 °C, which is the

recommended maximum value for a netX design. This value was chosen because the FIT-rate for

the silicon process, which netX are based on, shows a significant rise in the temperature range

between 100°C and the absolute maximum junction temperature. However, since the absolute

max. junction temperature is 125 °C, it is at the device manufacturer’s discretion if he wants to

follow this recommendation or rather decides to accept a higher junction temperature and trade a

decrease of the MTBF of his devices for a higher temperature range specification.

netRAPID devices have a thermal pad at the bottom for heat dissipation to the PCB of the host

system.

Important note: You must use a thermal pad on the PCB for the host system. This is absolutely

necessary in order to reach the temperature range for netRAPID devices.

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Carrier 30HH Service Manual Page 13